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 SEMiX653GAR176HDs
Absolute Maximum Ratings Symbol
IGBT VCES IC ICnom ICRM ICRM = 2xICnom VCC = 1000 V VGE 20 V VCES 1700 V VGES tpsc Tj Inverse diode IF Tc = 25 C Tc = 80 C Tj = 125 C Tj = 150 C Tc = 25 C Tc = 80 C 1700 619 438 450 900 -20 ... 20 10 -55 ... 150 545 365 450 IFRM = 2xIFnom tp = 10 ms, sin 180, Tj = 25 C 900 2900 -40 ... 150 Tc = 25 C Tc = 80 C 545 365 450 IFRM = 2xIFnom tp = 10 ms, sin 180, Tj = 25 C 900 2900 -40 ... 150 600 -40 ... 125 AC sinus 50Hz, t = 1 min 4000 V A A A A V s C A A A A A C A A A A A C A C V
Conditions
Values
Unit
SEMiX(R) 3s
Trench IGBT Modules
SEMiX653GAR176HDs
Tj = 150 C
IFnom
Features
* Homogeneous Si * Trench = Trenchgate technology * VCE(sat) with positive temperature coefficient * UL recognised file no. E63532
IFRM IFSM Tj
Freewheeling diode IF IFnom IFRM IFSM Tj Module It(RMS) Tstg Visol Tj = 150 C
Typical Applications*
* AC inverter drives * UPS * Electronic welders
Characteristics Symbol
IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint IC = 450 A VGE = 15 V chiplevel Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VGE = 15 V Tj = 25 C Tj = 125 C 5.2 Tj = 25 C Tj = 125 C f = 1 MHz f = 1 MHz f = 1 MHz 39.6 1.65 1.31 4200 1.67 2 2.45 1 0.9 2.2 3.4 5.8 2.45 2.9 1.2 1.1 2.8 4.0 6.4 3 V V V V m m V mA mA nF nF nF nC
Conditions
min.
typ.
max.
Unit
VGE=VCE, IC = 18 mA VGE = 0 V VCE = 1700 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 C
GAR (c) by SEMIKRON Rev. 1 - 24.06.2010 1
SEMiX653GAR176HDs
Characteristics Symbol
td(on) tr Eon td(off) tf Eoff
Conditions
VCC = 1200 V IC = 450 A RG on = 3.6 RG off = 3.6 Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C per IGBT Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C IF = 450 A Tj = 125 C di/dtoff = 4200 A/s T = 125 C j VGE = -15 V Tj = 125 C VCC = 1200 V per diode Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C IF = 450 A Tj = 125 C di/dtoff = 4200 A/s T = 125 C j VGE = -15 V Tj = 125 C VCC = 1200 V per diode
min.
typ.
290 90 300 975 190 180
max.
Unit
ns ns mJ ns ns mJ
SEMiX(R) 3s
Trench IGBT Modules
SEMiX653GAR176HDs
Rth(j-c)
0.054 1.7 1.7 0.9 0.7 1.3 1.8 1.1 0.9 1.3 1.8 380 130 73 0.11 1.7 1.7 0.9 0.7 1.3 1.8 1.1 0.9 1.3 1.8 380 130 73 0.11 20 1.9 1.9 1.3 1.1 1.3 1.8 1.90 1.9 1.3 1.1 1.3 1.8
K/W V V V V m m A C mJ K/W V V V V m m A C mJ K/W nH m m K/W
Inverse diode VF = VEC IF = 450 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c)
Features
* Homogeneous Si * Trench = Trenchgate technology * VCE(sat) with positive temperature coefficient * UL recognised file no. E63532
Typical Applications*
* AC inverter drives * UPS * Electronic welders
Freewheeling diode VF = VEC IF = 450 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE' Rth(c-s) Ms Mt w Temperatur Sensor R100 B100/125 res., terminal-chip per module to heat sink (M5)
TC = 25 C TC = 125 C 3 to terminals (M6) 2.5
0.7 1 0.04 5 5 300
Nm Nm Nm g K
Tc=100C (R25=5 k) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K];
493 5% 3550 2%
GAR 2 Rev. 1 - 24.06.2010 (c) by SEMIKRON
SEMiX653GAR176HDs
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
(c) by SEMIKRON
Rev. 1 - 24.06.2010
3
SEMiX653GAR176HDs
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 1 - 24.06.2010
(c) by SEMIKRON
SEMiX653GAR176HDs
SEMiX 3s
spring configuration
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
(c) by SEMIKRON
Rev. 1 - 24.06.2010
5


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